This article explains the thought process to guide before estimating the Die-size of a Chip.

• Make a List of the Intellectual Property and their corresponding Area count
• What is the Manufacturing Process Targetted
• Is the chip pad limited or core limited
• What is the utilization factor targeted
• What is the total memory area in the chip
• What is the package requirement (Flipchip/Wirebond)
• Preparation of Padring based on the Interface requirements
• What is the estimated gatecount per sq mm2 in the specific process
• What is the total Chip area
• Derive X & Y co-ordinates of the Chip
• What is the area for scribe-line